The core process is based on a proprietary controlled anodization phase that forms the Aluminum-Oxide (Al2O3) in a nano-porous structure.
The controlled anodization of any geometric pattern throughout the entire substrate thickness creates an Aluminum-Oxide (Al2O3) insulating layer that surrounds the shaped Aluminum via that serves as electrically isolated thermal pad.
In this “reverse” process the anodization replaces the conventional steps of drilling and metallic coating in standard PCBs, yielding a fully filled via with excellent thermal conduction.
The remaining steps adopt standard semiconductor and PCB procedures that guarantee repeatable high volume production at very low cost.