High-Brightness LEDs are one of the hotter devices that modern microelectronics can produce. As daily users we are all aware of the hurdles of keeping our laptop cool enough to operate. However, given the smaller size of the HB-LED die the power density per area that the die needs to dissipate could be tenfold higher than that of a state-of-the-art IC package. ALOX™ is ideal material for HB-LED packaging since its thermal conductivity is ten times higher than that of ceramic substrates.