Technology Overview

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Technology
Overview

MCL - Micro Components Ltd. has developed a revolutionary and proprietary
substrate technology named ALOX^TM.
ALOX^TM is a unique multilayer substrate technology developed for
microelectronics packaging applications.
The technology is protected by several patents.
In ALOX^TM, no via drill and plating is required - the via is of solid full aluminium
and the dielectric is of a high quality ceramic nature. The process is simple and
low cost, and contains a low number of process steps.
The ALOX^TM technology serves as a wide technology platform, and can be
implemented in various electronics packaging applications such as for RF,
SiP, 3-D memory stacks, MEMS and high power modules and components.

The advantages of ALOX^TM substrates over the competition - either
laminate/build-up substrate based or ceramic based - are both in technical
performance and in cost.

Main technical advantages:

Superior thermal properties, due to embedded integral aluminium heat-sink
option: ceramic matrix, very thin, low profile.

High speed, due to the special vias built of full aluminium of very low
inductance.

Very high routing density - metal layers having copper signal layers of
<1/1 mil line/space.

Option for building special features needed for RF applications, strip lines,
wave guide structures, controlled impedance lines.

easy option for including integrated passives such as resistors in the multilayer.

Cost advantages:

Production costs are significantly lower relative to competitive PCB-type
substrate technologies, mainly due to lack of the drilling
and hole plating processes.

Basically, ALOX provides a ceramic-based substrate, fabricated by a minimal
number of steps of PCB-like processes and manufacturing techniques.

ALOX^TM Design Guide.

For more information please contact us.