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ALOX^TM BGA

High Power
            Heavy Metal
            ALOX-CLAD^TM

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Substrates

High Power Metal Substrates: ALOX-CLAD^TM:

ALOX^TM is employed as an enabling technology to create a clad
structure where aluminum panel is embedded in or covered with
ALOX^TM based dielectric layer.
ALOX-CLAD^TM structure is typically built of 0.5-2.5 mm aluminum
base with ~40mm of ALOX^TM ceramic dielectric layers separating
the aluminum core from the top circuitry.
The basic structure is typically plated with heavy copper circuitry
specifically patterned and designed according to customer specific design.

Two main competing technologies for high power and voltage applications
are direct bonded copper (DBC) and Aluminum panels covered with certain
polymeric adhesive materials of relatively low thermal resistance.

Typical main properties for ALOX-CLAD^TM are:

Thermal resistance:0.014 [DegC x inch2 /Watt]

Dielectric strength of insulating ALOX layer:<5KVolt

ALOX-CLAD substrate typical structure

Compare Table:

	Material	Sq. inch
Area required to dissipate 1 watt @ max substrate temperature =125^OC & ambient temperature = 25^OC	FR4	3
	Direct Bond Copper	1
	Aluminum insulated with polymer	1
	MCL' ALOX- CLAD	0.2

For additional information on our substrates offering go to Technology
section.

For more information please contact us.