Home        Substrates          Multilayer              ALOXTM BGA          High Power             Heavy Metal             ALOX-CLADTM        SuperPakTM           Family          High power             BGA SiP          Metal RFCSP          High power             CSP		Products Substrates MultiLayer ALOXTM BGA: MCL supplies custom designed, ALOX based multilayer substrates. Typically the product is in BGA or LGA configuration. Substrate finish is standard Ni-Gold and fit for all standard assembly techniques: wire bonding, soldering or flip chip. The substrates can be used for various applications including high power CSPs, RF devices and modules, power System in Package (SiP) modules, DRAM and Flash memory stacks and other applications. The substrates are fabricated in 4"X4" panel size, including 3 metal layers, and of 200 or 250 mm thickness. The panels can be diced to various sizes according to specific package and assembly design.   For additional information on our substrates offering go to Technology    section.   For more information please contact us.
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