Process Flow

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Process Flow

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Technology
Process Flow

The key element and most complex process step in every multilayer
interconnect technology is the via - an electrical connection between two
adjecent metal layers separated by a dielectric material.
In the conventional technologies a dielectric sheet is used as base material,
in which the vias are formed using drilling (etching or punching) and hole
plating process.
MCL ALOX^TM process is much simler and do not require drilling and hole plating.
The starting material in the MCL process is a conductive aluminum sheet.
The first step in the process is masking the top and bottom of the sheet using
conventional lithography techniques.
The vias are formed using anodization of the sheet through the whole
thickness of the sheet.
The exposed areas are converted into aluminum oxide which is ceramic in nature
and a higly insuling dielectric material.
The protected unexposed areas remain as aluminum elements-the connecting vias.
Using this innovative process a multilayer low cost ceramic board is formed.

The complete three metal layer core contains an internal aluminum layer,
top and bottom copper layers with though vias and blind vias incorporated in
the structure.
The technology is of best qualities - a very simple and low cost production
process; excellent thermal performance product, superior mechanical and
electrical properties.

Technical Presentation.

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