 Home
Packaging
|
Packaging Sevices Based on ALOXTM substrate technology, MCL provides contract packaging services for its SuperPakTM packages. ALOXTM substrates are compatible and fit all conventional assembly techniques including BGA, Flip Chip, COB, wire-bonding and conventional encapsulation approaches. MCL can provide SuperPakTM packages employing all the abovementioned techniques as appropriate for each packaging case. MCL utilizes a board level packaging methodology (in parallel to wafer level processing approach), which means that the company packages the entire substrate at one time, rather than packaging individual diced chips. This results is significant assembly cost saving, simplicity and ease of board testing, and board area saving. Employing the board level assembly methodology MCL can provide semiconductor packaging solutions for a broad spectrum of applications including power modules, memory, logic, RF, analog, and various SiP (System in Package) modules. Quick Turn Around New package design and qualification process can take 8-10 weeks from the beginning of package design to delivery of the first packaged units. For more information please contact us. |