ALOX^TM Substrate, Technical Specification

Parameter	Units	Value		Comment / Advantage
Geometrical & Finish Parameters
Total Thickness	mm	75 - 300		Typical 100-200. Very low profile! Less than 50% of convention profile!
Internal aluminum layer Line/space	mm	100/100		Used for ground and power layers. Very fine resolution for the application!
Internal aluminum layer Thickness	mm	30-140		Option for very heavy ground and power layers.
Top & Bottom layers line/space Top Copper layer thickness	mm mm	25/25 6-20-35		Current Minimum value, Cutting edge resolution! Typical values. Heavier copper traces can be fabricated
Via width/Pitch (min)	mm	140/250		For substrate thick of 125mm. Current cutting edge resolution for Core applications
Via Pad (= Land size) (min) (For Substrate. Thickness of 125mm.)	mm	40		Land size equal to pad is impossible to achieve in conventional technology. Typically for conventional boards land size is three times the pad size. Dramatic advantage for ALOX in terms of routing density!
Finish Parameters (Typical)	Nickel/Gold 5/0.2 mm & Solder mask			Typical
Mechanical and Thermal Parameters
Young Modulus (E)	Mpa	130		Very high and clear advantage over plastics
Poison Ratio (n)	--	0.29
Thermal Coefficient of Expansion (TCE)	ppm/deg	7.8		This value is adjustable. Value is ranging from 8-12. Great advantage over plastics in matching properties to the silicon die.
Flexural Strength	MPa	60,000
Thermal Conductivity of the Dielectric	Watt/mxdeg	12-20		Property of the Dielectric. Significant advantage. Integral Heat Sink option !
	Integral Thermal via option!
Operating temperatures	Deg.	<300^oC		Extendable to <350^oC;
Reliability
1000 thermal cycles test, 1000 vias chain, 0.5 mm pitch	% chain resistance change		< 3% Pass	-55^0C to +125^0C JESDC 22-A104-B / PASS!

Electrical Data

Parameter	Conditions/std.	Units	Value	Comments
Dielectric Constant	50 Mhz - 20 GHz		6.6	Outsource measure
Dissipation Factor	50 Mhz - 20 GHz		<1.2%	Outsource measure
Withstand Voltage	@40 mm	Volts	>1000 (25Volts /mm)	MCL measurement
Via Series Resistance	Via chain,		< 10mW	MCL measurement
Via inductance	Dtop=50 mm H=200 mm Dcenter =250mm	pH	8.4 ±10%	Calculation
Blind Via inductance		pH	4.2±10%	Calculation
Via Capacitance
Resistivity of Cu traces	@ 20 mm and 10mm respectively	W/square.	0.0017-0.0025	MCL measurements
Type of Impedance Line		NA	Microstrip Strip lines, differncial,
Options		NA	Split in ground /voltage layer, large vias
Characteristic impedance for transmission line			25-100 W	Outsource measure + estimate
Impedance line tolerance			±10%	Estimated
Delay		ps/inch	160-180	Outsource measure
Optional – Integral Coils			Integral Coils
Leakage current (Rvia-g)	@500Volts	W	10exp13	TV2 (Outsource)
Leakage current (Rz)	@150Volts	W cm	3*10exp12	TV2 (Outsource)
Surface resistance (Rs)	@150Volts	W /sq	3*10exp13	TV2 (Outsource)