About Us

About Us
Overview

MCL is engaged in the development and production of ceramic and metal based
advanced multilayer packages and substrates for the electronics industry.
Main applications are in advanced packaging of high pin count components,
System in Package (SiP), RF and high power packaging applications.
The main attribute of the products is its superior thermal properties, based on
an advanced multilayer substrate having high content of aluminium embedded
in a ceramic-based dielectric matrix.

The Company is privately held, located in the northern part of Israel, and having
a sales office in Phoenix, AZ.
The company is located in a modern 8,500 sq. ft. facility, including 4,000 sq. ft.
of clean room environment (class 1,000 and 10,000), and production equipment
for 6 inch substrate sizes.

MCL is committed to the highest standards of quality and reliability and is certified
to ISO2000.

MCL has supplier relationships with several industry leaders, and is set to produce
production lots and prototype samples in a short turnaround mode.

For more information please contact us.