MCL develops, licenses and provides Aluminum-based advanced multilayer substrates for the high-power electronics industry.
MCL proprietary ALOX™ substrate and packaging technology has superior thermal management and excellent reliability that result in higher, yet cost effective, performance.
The company innovative solutions enable better thermal, higher functionality and lighter weight for wide range of applications including high power LED lighting, power boards for various applications including modules for automotive components, and power RF boards.

Company – Private; Established in 1993, Based in Migdal Haemek, Israel.
Business – High-power thermal management solutions for microelectronics packaging with main focus on integrated high-brightness LEDs.
Technology – ALOX™ – Innovative and proprietary packaging and substrate fabrication technology with superior thermal management properties.
Patents – The technology is patent protected by portfolio of multinational patents.
Facilites – R&D – 8,500 square feet pilot plant, Migdal Haemek, Israel.